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UCLA-WINMEC - Green Tech


GREEN Electronics for Wireless and RFID

UCLA-WINMEC has been researching new frontiers of green methods as applied to wireless and RFID-based electronic products. Wireless and RFID-based devices today contain a significant amount of environmentally harsh substances. This research involves studying existing products for the hazardous substances and coming up with new electronic paradigms to support industrial ecology by way of greener products. An advisory board is currently being formed and companies such as HP, Intel, Qualcomm, T.I. Motorola, and other leaders are being invited to participate.


Green I.T.

After decades of relatively slow progress in ecologically friendly industrial developments (aka Industrial Ecology), the United States of America now finds itself in the midst of a relative crisis both on the environmental and energy fronts. Recent changes indicate that Green Technologies are now expected to play center-stage in the United States' National agenda. UCLA-WINMEC has launched a new Green Technology forum to discuss how advanced technologies that are integrated with I.T. infrastructure can be used to assist this national agenda and conversely how ecologically friendly approaches developed in other disciplines can be applied to technology.

Four essential ingredients of Green technologies - monitoring, renewing, conserving, and, recycling - will be discussed and how new developments out of industrial research labs, tech startups, universities etc. are creating innovative opportunities and challenging the existing status quo will be presented.

Distribution and availability of such technology to the common enterprise is a challenge - discussions will address these issues. Business, technical and research opportunities in Green Industrial Ecology would be presented by participants. The business economics of Industrial Ecology and its relationship to government policies including regulation, taxes, etc. would be important topics of discussion. The inter-relationship between developing a business case and advancement of new green technologies is an important issue for the sustained growth of this industry and will be discussed.

Greentech Forum, 2008 Representatives from industries including Power/Electricity, Water, Utilities, Oil, Mining, Manufacturing, Automotive, Aerospace, I.T., Construction, Infrastructure, etc. were invited to participate in this open forum. On Feb 27th, along with CIO Impacts Forum, we initiated this discussion and now look forward to participation from the community.


Topics include:

  • Green technologies leading to green businesses
  • Eco-friendly and renewable energy sources such as bio-fuels
  • Monitoring, conserving and clean-up technologies
  • Integration of technologies with I.T. infrastructure
  • Modeling, measuring and obtaining the benefits of implementing green technologies
  • Public policy, government subsidies, and mandates
  • Measuring ROI/benefits
  • Internally motivated versus externally imposed solutions
  • Buying/selling of carbon trading/offsets, technology to make it possible

MEDIA COVERAGE

UCLA's WINMEC Starts Green RFID Research Project, RFID World On-line, http://www.rfid-world.com/news/208402161/, June 4, 2008

Related Publications

Description Author(s) File
"On The Creation of the a Unified Modeling Language Based Collaborative Virtual Assembly/Disassembly System" - ASME DETC 2003 Design Engineering Technical Conferences and Computers and Information in Engineering Conference, Sep 2-6, 2003, Chicago, Illinois Jianzhong Mo, Chi-Cheng Chu, B.S. Prabhu, Rajit Gadh
"A Non-interfering selective disassembly sequence for components with geometric constraints", IIE Transactions, Vol. 34, Issue 4, pp. 349-361, April 2002. H. Srinivasan and R. Gadh
"Efficient Geometric Disassembly of Multiple Components from an Assembly using Wave Propagation", ASME Journal of Mechanical Design, Vol. 122, Issue 2, pp. 179-184. H. Srinivasan and R. Gadh
"Virtual Selective Disassembly Analysis of Geometric Assembly Models", pp. 1-136, 2000. H. Srinivasan and R. Gadh Title Page Table of Contents
"Geometric Abstractions to Support Disassembly Analysis", IIE Transactions on Design and Manufacturing, Vol. 31, No. 10, 935-946, August 1999. N. Shyamsundar and R. Gadh
"Selective Disassembly for Virtual Prototyping as applied to De-Manufacturing", Journal of Robotics and Computer Integrated Manufacturing, Vol. 15, No. 3, pp. 231-245, 1999. H. Srinivasan, R. Figueroa and R. Gadh
"Selective Disassembly of Components with Geometric Constraints", ASME International Conference on Design for Manufacturing, Las Vegas, Nevada, USA, Paper No. DETC99/DFM-8961. H. Srinivasan and R. Gadh  
"Selective Disassembly: Representation and Comparative Analysis of Wave Propagation Abstractions in Sequence Planning", IEEE International Conference on Assembly and Task Planning, Porto, Portugal, Paper No. ATP/USA/17, July 21-24, 1999. H. Srinivasan and R. Gadh
"Complexity Reduction in Geometric Selective Disassembly Using the Wave Propagation Abstraction", Proceedings of the IEEE International Conference on Robotics and Automation, Leuven, Belgium, May 16-21, 1998. H. Srinivasan and R. Gadh
"Destructive Disassembly to Support Virtual Prototyping", IIE Transactions, Vol. 30, No.10, pp. 959-972, 1998. K. Lee and R. Gadh
"A Geometric Algorithm for Single Selective Disassembly Using the Wave Propagation Abstraction", Journal of Computer-Aided Design, Elsevier Publications, Vol. 30, no. 8, pp. 603-613, 1998. H. Srinivasan and R. Gadh
"Geometry-based Metric Formulation and Methodology to Support Virtual Design for Disassembly", Journal of Engineering Design and Automation, Vol. 4, No.1, pp. 13-26. N. Shyamsundar, Z. Ashai and R. Gadh  
"A Methodology to Design for Selective Disassembly", Proceedings of the International Symposium on Tools & Methods for Concurrent Engineering, Manchester, UK, pp. 321-328. H. Srinivasan and R. Gadh  
"Virtual Disassembly - A Software Tool for Developing Product Dismantling and Maintenance Systems", Proceedings of the RAMS - Symposium on Reliability and Maintainability, Anaheim, CA, pp. 120-125, January 19-22, 1998. R. Gadh, H. Srinivasan, N. Shyamsundar and R. Figueroa
"A Framework for Virtual Disassembly Analysis", Journal of Intelligent Manufacturing, Chapman & Hall, Vol. 8, No. 4, pp. 277-295. H. Srinivasan, N. Shyamsundar and R. Gadh  
"Geometric Abstractions to Support Disassembly Evaluation", Proceedings of DETC 97, 23rd ASME Design Automation Conference, Sacramento, CA. N. Shyamsundar and R. Gadh  
"Virtual De-manufacturing Via Virtual Disassembly to Design Environmentally Conscious Products", International Journal of Environmentally Conscious Design and Manufacturing, ECM Press, Vol. 6, No. 1, pp. 37-50. N. Shyamsundar, H. Srinivasan and R. Gadh  
"A Virtual Disassembly Tool to Support Environmentally Conscious Product Design", Proceedings of 1997 International Symposium on Electronics and the Environment (IEEE), San Francisco, CA, pp. 7-12, May 5-7, 1997. H. Srinivasan, N. Shyamsundar and R. Gadh
"Virtual Selective Disassembly: A Geometric Tool to Achieve Net Positive Environmental Value", Proceedings of 30th ISATA, Florence, Italy, pp. 425-432. H. Srinivasan and R. Gadh  
"Computer Aided Design-for-Disassembly: A Destructive Approach", Proceedings of IEEE International Symposium on Electronics and the Environment, Dallas, TX, May 6-8, 1996. K. Lee and R. Gadh
"Design for Disassembly Methodology for Virtual Prototypes", Proceedings of 1996 Design for Manufacturing Conference, ASME Design Engineering Technical Conferences, Irvine, CA, pp. 3159-3164. N. Shyamsundar, Z. Ashai, R. Gadh  
"Design for Disassembly to Support Environmentally Conscious Design", Proceedings of Conference on Environmentally Conscious Design and Manufacturing, Cleveland, Ohio. N. Shyamsundar, H. Srinivasan and R. Gadh  
"Selective Disassembly of Virtual Prototypes", Proceedings of 1996 IEEE International Conference on Systems Man and Cybernetics, Beijing, China, pp. 3159-3164, October 14-17, 1996. N. Shyamsundar and R. Gadh
"Design for Disassembly: A Destructive Approach", Proceedings of Joint Symposium on Concurrent Product and Process Engineering, International Mechanical Engineering Congress and Exposition, San Francisco, CA, pp. 237-249. K. Lee and R. Gadh  
"Destructive Design for Disassembly to Support DFE: A Virtual Prototyping Approach", Proceedings of International Conference on Advances in Mechanical Engineering, T.S. Mruthyunjaya, Bangalore, India, pp. 441-465. K. Lee and R. Gadh  


Dr. Gadh, Director of this program, has been recipient of the 1997 NSF/LUCENT TECHNOLOGIES INDUSTRIAL ECOLOGY RESEARCH FELLOWSHIP award. http://www.nsf.gov/news/news_summ.jsp?cntn_id=102834


For further information or sponsorship information please email: greentech@cio-conference.ucla.edu